@inproceedings{inproceedings, title = {{Modelling the enhancement to the thermal performance of encapsulants using thermally conductive filler materials}}, publisher = {{Stuttgart, Germany; Mesago PCIM GmbH; [2014]}}, url = {{}}, year = {{2015}}, month = {{6}}, author = {{Hewitt D and Stone DA and Foster MP}}, journal = {{PCIM Asia Conference Proceedings}}, note = {{Accessed on 2025/04/14}}}