TY  - JOUR

T1  - Low-temperature active soldering of 5A06-Al alloy and Ti-Cu-Ni alloy mesh-reinforced SAC305 composite solder: Interfacial bonding behavior and joint properties

JO  - Journal of Materials Science & Technology

UR  - https://doi.org/10.1016/j.jmst.2025.01.070

PY  - 2025/04/01

AU  - Li D

AU  - Xi B

AU  - Xiao Y

AU  - Song L

AU  - Zhang J

AU  - Luo D

AU  - Goodall R

ED  - 

DO  - DOI: 10.1016/j.jmst.2025.01.070

PB  - Elsevier BV

Y2  - 2025/04/18

ER  -